Hussein T. Mouftah, Ottawa University, Canada.
Cheng Li, Memorial University, Canada
Jun Zheng, Southeast University, China
Douglas Blough, Georgia Institute of Technology, USA
Pascal Lorenz, University of Haute Alsace, France
Xianbin Wang, Western University, Canada
Jian Ren, Michigan State University, USA
Tomohiko Taniguchi, Fujitsu, Japan
Shiwen Mao, Auburn University, USA
Tony Quek, Singapore University of Technology and Design, Singapore
Roberto Rojas-Cessa, New Jersey Institute of Technology, USA
Yan Zhang, University of Oslo, Norway
Stefano Giordano, University of Pisa, Italy
Song Guo, The Hong Kong Polytechnic University, China
Xiang Gui, Massey University, New Zealand
Tongtong Li, Michigan State University, USA.
Nathalie Mitton, INRIA, France
Hidekazu Murata, Yamaguchi University, Japan
Senad Busovaca, California State University, USA
EK Park, North Carolina Central University, USA
Haris Gacanin, RWTH Aachen University, Belgium
Industrial Program Co-Chairs
Swetha Muniraju, Nokia Bell Labs, Belgium
Jin Yang, Futurewei, USA
Irena Atov, Microsoft, USA
Yuanzhu Chen, Memorial University, Canada (yzchen@mun.ca)
Himal A Suraweera, University of Peradeniya, Sri Lanka (himal@eng.pdn.ac.lk)
Zou Su, Xi’an Jiaotong University, China (zhousu@ieee.org)
Bong Jun Choi, Soongsil University, Korea (davidchoi@soongsil.ac.kr)
Chin-Tser Huang, University of South Carolina, USA (huangct@cse.sc.edu)
Paolo Bellavista, Università di Bologna, Italy (paolo.bellavista@unibo.it)
Xiliang Luo, Shanghai Tech University, China (luoxl@shanghaitech.edu.cn)
Jelena Misic, Ryerson University, Canada (jmisic@scs.ryerson.ca)
Peter Chong, Auckland University of Technology, New Zealand (peter.chong@aut.ac.nz)
Walid Saad, Virginia Tech, USA (walids@vt.edu)
Zhi Sun, Tsinghua University, China (zhisun@tsinghua.edu.cn)
Luigi Atzori, University of Cagliari, Italy (l.atzori@ieee.org)
Guosen Yue, Google LLC, USA (yueguosen@gmail.com)
Christian Poellabauer, Florida International University, USA (cpoellab@fiu.edu)
Zijun Gong, Hong kong University of Science and Technology (Guangzhou), China (gongzijun@ust.hk)
Noriaki Kamiyama, Fukuoka University, Japan (kamiyama@fukuoka-u.ac.jp)
Jemal Abawajy, Deakin University, Australia (jemal.abawajy@deakin.edu.au)
Martin Maier, National Institute for Scientific Research (INRS), Canada (maier@emt.inrs.ca)
Luca Valcarenghi, Scuola Superiore Sant’Anna, Italy (luca.valcarenghi@sssup.it)
Zuqing Zhu, University of Science and Technology of China, China (zqzhu@ieee.org)
Rui Dini, Universidade NOVA de Lisboa, Portugal (rdinis@fct.unl.pt)
Chong Han, Shanghai Jiaotong University, China (chong.han@sjtu.edu.cn)
Burak Kantarci, University of Ottawa, Canada (burak.kantarci@uOttawa.ca)
Hyunbum Kim, University of North Carolina at Wilmington, USA (kimh@uncw.edu)
Saadi Boudjit, University Sorbonne Paris Nord, France, (boudjit@univ-paris13.fr)
Baoxian Zhang, University of Chinese Academy of Sciences, China (bxzhang@ucas.ac.cn)
Josep Miquel Jornet, Northeastern University, USA (jmjornet@northeastern.edu)
Xintong Ling, Southeast University, China (xtling@seu.edu.cn)
Lotfi Mhamdi, University of Leeds, UK (l.mhamdi@leeds.ac.uk)
Michelle Park, TIA, USA
Jianfei Shao, Maxim, USA
Zehan Wang, Twitter, UK
Senad Busovaca, CSU, USA
EK Park, KSU, USA
Irene Cheng, Univ. Alberta, Canada
Dacheng Tao, University of Technology Sydney, Australia
Tingkai Wang, London Metropolitan University, UK
Mei-Ling Shyu, University of Miami, USA
Hai Lin, Osaka Prefecture University, Japan
Guan Gui, NUPT, China
Mario Gerla, University of California, Los Angeles, USA
Aggelos K. Katsaggelos, Northwestern University, USA
Peter Muller, IBM, Switzerland
EK Park, KSU, USA
Mukesh Singhal, University of California, Merced, USA
Tomohiko Taniguchi, Fujitsu, Japan
Vahid Tarokh, Harvard University, USA
Haohong Wang, TCL Research America, USA
Guoliang Xue, Arizona State University, USA