Technical Program Committee Members


Ali Abedi University of Maine USA
Koichi Adachi Institute for Infocomm Research (I2R) Singapore
Ferran Adelantado Universitat Oberta de Catalunya Spain
Shakeel Ahmad De Montfort University United Kingdom
Ozgur Akan Koc University Turkey
Kemal Akkaya Southern Illinois University USA
Fakhrul Alam Massey University New Zealand
Basheer Al-Duwairi Jordan University of Science and Technology Jordan
Slavisa Aleksic Vienna University of Technology Austria
George Amariucai Iowa State University USA
Wei An High Performance Nework Lab, IOA, Chinese Academy of Sciences P.R. China
Vishal Anand The College at Brockport, State University of New York USA
Bhojan Anand National University of Singapore Singapore
Alessandro Andreadis University of Siena Italy
Tricha Anjali Illinois Institute of Technology USA
Rafael Antonello Instituto Federal de Alagoas Brazil
Angelos Antonopoulos Telecommunications Technological Centre of Catalonia (CTTC) Spain
George Athanasiou KTH Royal Institute of Technology Sweden
Edward Au Marvell Semiconductor, Inc. USA
Abdelmalik Bachir Imperial College London United Kingdom
Venkataramana Badarla Indian Institute of Technology Jodhpur India
Leonardo Badia Università degli Studi di Padova Italy
Mohammad Banat Jordan University of Science and Technology Jordan
Payam Barnaghi University of Surrey United Kingdom
Javier Barria Imperial College London United Kingdom
Stefano Basagni Northeastern University USA
Mostafa Bassiouni University of Central Florida USA
Elena Veronica Belmega ENSEA/UCP/CNRS France
Anass Benjebbour NTT DoCoMo, Inc. Japan
Jalel Ben-Othman University of Paris 13 France
André-Luc Beylot IRIT Toulouse France
Rajdeep Bhowmik Cisco Systems, Inc. USA
Yuanguo Bi Northeastern University P.R. China
Dai Bin Huazhong University of Science and Technology P.R. China
Andrew Blaich Bluebox Security USA
Ai Bo Beijing Jiaotong University P.R. China
Alessio Botta University of Napoli Federico II Italy
Dario Bottazzi Marconi Labs Italy
Julien Bourgeois UFC/FEMTO-ST Institute France
Khaled Boussetta University of Paris 13 France
Timothy Brothers Georgia Institute of Technology USA
Manoj Bs Indian Institute of Space Science and Technology India
Lin Cai University of Victoria Canada
Christian Callegari University of Pisa Italy
Prasad Calyam University of Missouri-Columbia USA
Berk Canberk Istanbul Technical University Turkey
Luca Canzian University of California, Los Angeles USA
Xianghui Cao Illinois Institute of Technology USA
Jiannong Cao Hong Kong Polytechnic Univ Hong Kong
Antonio Caruso University of Salento Italy
Paolo Casari University of Padova Italy
Maurizio Casoni University of Modena and Reggio Emilia Italy
Dave Cavalcanti Philips Research USA
Walter Cerroni University of Bologna Italy
Isabella Cerutti Scuola Superiore Sant'Anna Italy
Chan-Byoung Chae Yonsei University Korea
Sammy Chan City University of Hong Kong Hong Kong
Rajarathnam Chandramouli Stevens Institute of Technology USA
Dah-Chung Chang National Central University Taiwan
Yusun Chang Southern Polytechnic State University USA
Mainak Chatterjee University of Central Florida USA
Periklis Chatzimisios Alexander TEI of Thessaloniki Greece
Abdellah Chehri University of Ottawa Canada
Samuel Chen Sun Yat-sen University P.R. China
Shanzhi Chen China Academy of Telecommunication Technology P.R. China
Wei-Peng Chen Fujitsu Laboratories of America USA
Yu Chen Binghamton University USA
Zhenzhong Chen Wuhan University P.R. China
Jiming Chen Zhejiang University P.R. China
Ling-Jyh Chen Academia Sinica Taiwan
Zhuo Chen InterDigital Communications USA
Thomas Chen City University London United Kingdom
Wei Chen Tsinghua University P.R. China
Jian Chen Nanjing University of Posts and Telecommunications P.R. China
Jung-Chieh Chen National Kaohsiung Normal University Taiwan
Yung-Fang Chen National Central University Taiwan
Ken Chen Université Paris 13 France
Hui Chen Virginia State University USA
Ping Chen UMass-Boston USA
Lei Chen Sam Houston State University USA
Wei Cheng Virginia Commonwealth University USA
Erkang Cheng Temple University USA
Xiang Cheng Peking University P.R. China
Wen-Huang Cheng Academia Sinica Taiwan
Xilin Cheng Colorado State University USA
Shi Cheng Silicon Image Inc. USA
Julian Cheng University of British Columbia Canada
Yu Cheng Illinois Institute of Technology USA
Harsha Chenji University of Texas at Dallas USA
Stefano Chessa University of Pisa Italy
Man Hon Cheung The Chinese University of Hong Kong Hong Kong
Woong Cho Jungwon University Korea
Young-June Choi Ajou University Korea
Bong Jun Choi The State University of New York (SUNY) Korea Korea
Kaushik Chowdhury Northeastern University USA
Hsiao-Chiang Chuang Qualcomm Technologies Inc. USA
Marcello Cinque University of Naples Italy
T. Charles Clancy Virginia Tech USA
Michele Colajanni University of Modena and Reggio Emilia Italy
Garth Crosby Southern Illinois University Carbondale USA
Haipeng Dai Nanjing University P.R. China
Alberto Dainotti CAIDA, UC San Diego USA
Gerard Damm Alcatel-Lucent USA
Pradipta De SUNY Korea Korea
Swades De Indian Institute of Technology Delhi India
Saptarshi Debroy University of Central Florida USA
Yi Deng Virginia Polytechnic Institute and State University USA
Jeremiah Deng University of Otago New Zealand
Jing Deng University of North Carolina at Greensboro USA
Ruilong Deng Nanyang Technological Universtiy Singapore
Chris Develder Ghent University - iMinds Belgium
Hao Di University of Electronic Science and Technology of China P.R. China
Yahui Di University of Massachusetts Boston USA
Marco Di Felice University of Bologna Italy
Marco Di Renzo French National Center for Scientific Research (CNRS) France
Minhua Ding Aalto University Finland
Wei Ding New York Institute of Technology USA
Wei Ding University of Massachusetts Boston USA
Hoang Dinh Nanyang Technological University Singapore
Thang Dinh Virginia Commonwealth University USA
Karim Djouani University Paris Est Créteil (UPEC) South Africa
Octavia Dobre Memorial University of Newfoundland Canada
Mianxiong Dong National Institute of Information and Communications Technology Japan
Falko Dressler University of Paderborn Germany
Qinghe Du Xi'an Jiaotong University P.R. China
Liang Du Temple University USA
Lijuan Duan Beijing University of Technology P.R. China
Qiang Duan The Pennsylvania State University USA
Lingjie Duan Singapore University of Technology and Design (SUTD) Singapore
Dongliang Duan University of Wyoming USA
Maurizio Dusi NEC Laboratories Europe Germany
George Efthymoglou University of Piraeus Greece
Stephan Eidenbenz Los Alamos National Laboratory USA
Youssef El Hajj Shehadeh TU Chemnitz Germany
Mohammed El Koutbi University Mohamed V - Souissi Morocco
Abdennour El Rhalibi Liverpool John Moores University United Kingdom
Jaafar Elmirghani University of Leeds United Kingdom
Ahmed Eltawil University of California, Irvine USA
Aiman Erbad Qatar University Qatar
Müge Erel Istanbul Technical University Turkey
Jialu Fan Zhejiang University P.R. China
Gianluigi Ferrari University of Parma Italy
Domenico Ficara Cisco Systems Switzerland
Mark Flanagan University College Dublin Ireland
Jeffrey Foerster Intel Corporation USA
Hacene Fouchal Université de Reims Champagne-Ardenne France
Xinwen Fu University of Massachusetts Lowell USA
Weihuang Fu Cisco Systems USA
Huirong Fu Oakland University USA
Shengli Fu University of North Texas USA
Jaafar Gaber UTBM France
Xiaoying Gan Shanghai Jiao Tong University P.R. China
Weihua Gao Qualcomm Inc. USA
Sudhanshu Gaur Hitachi America Ltd USA
Thierry Gayraud LAAS-CNRS, Université de Toulouse France
Mo Ghorbanzadeh Virginia Tech USA
Stefano Giordano University of Pisa Italy
Shimin Gong Nanyang Technological University Singapore
Kannan Govindan Samsung Advanced Institute of Technology SAIT India India
Visvasuresh Victor Govindaswamy Concordia University USA
Fabrizio Granelli University of Trento Italy
Tao Gu RMIT University Australia
Zhangyu Guan State University of New York at Buffalo USA
Isabelle Guérin Lassous Université Claude Bernard Lyon 1 - LIP France
Xiang Gui Massey University New Zealand
Songtao Guo Southwest University P.R. China
Jairo Gutierrez Auckland University of Technology New Zealand
Yassine Hadjadj-Aoul University of Rennes 1 France
Youngnam Han KAIST Korea
Hiroshi Hasegawa Nagoya University Japan
Jianping He Zhejiang University P.R. China
Liang He Singapore University of Technology and Design Singapore
Shibo He Arizona State University USA
Tamir Hegazy Georgia Institute of Technology USA
Martin Hellwig University of Massachusetts Boston USA
Xiaoyan Hong University of Alabama USA
Cynthia Hood Illinois Institute of Technology USA
Mohammad Hoque East Tennessee State University USA
Tobias Hoßfeld University of Wuerzburg Germany
Fen Hou University of Macau Macao
Hung-Yun Hsieh National Taiwan University Taiwan
Cheng-Hsin Hsu National Tsing Hua University Taiwan
Donglin Hu Auburn University USA
Chengchen Hu Xi'an Jiaotong University P.R. China
Kun Hua Lawrence Technological University USA
Qiang-Sheng Hua Tsinghua University P.R. China
Xinyi Huang Fujian Normal University Singapore
Yingsong Huang Auburn University USA
Xin Huang Deutsche Telekom R&D Lab USA USA
Yun Huang Carnegie Mellon University USA
He Huang Soochow University P.R. China
Bei Hui University of Electronic Science and Techology of China P.R. China
Seung-Hoon Hwang Dongguk University Korea
Vahid Jamali Friedrich-Alexander-University Erlangen-N¨urnberg Germany
Bo Ji Temple University USA
Zhen Jiang West Chester University of Pennsylvania USA
Hongbo Jiang Huazhong University of Science and Technology P.R. China
Tao Jiang Huazhong University of Science and Technology P.R. China
Hai Jiang University of Alberta Canada
Hao Jin InterDigital Communications, LLC USA
Xin Jin The University of Hong Kong USA
Henric Johnson Blekinge Institute of Technology Sweden
Changhee Joo UNIST Korea
Josep Miquel Jornet University at Buffalo USA
Jason Jue University of Texas at Dallas USA
Rakpong Kaewpuang University of Manitoba Canada
Carlos Kamienski Universidade Federal do ABC Brazil
Markus Kampmann Koblenz University of Applied Sciences Germany
Dimitris Kanellopoulos University of Patras Greece
George Karagiannidis Aristotle University of Thessaloniki Greece
Georgios Karagiannis University of Twente The Netherlands
Ghassan Karame NEC Laboratories Europe Germany
Helen Karatza Aristotle University of Thessaloniki Greece
Dimitrios Katselis KTH Royal Institute of Technology Sweden
Rajkumar Kettimuthu Argonne National Lab USA
Ala Khalifeh German University of Jordan Jordan
Jamil Khan The University of Newcastle Australia
Tamer Khattab Qatar University Qatar
Hyun-chul Kim Sangmyung University Korea
Hongseok Kim Sogang University Korea
Tae-Hoon Kim Purdue University Calumet USA
Abdellatif Kobbane ENSIAS, University Mohammed V-Souissi Morocco
Samad Kolahi Unitec Institute of Technology New Zealand
Lisimachos Kondi University of Ioannina Greece
Kimon Kontovasilis NCSR Demokritos Greece
Dimitrios Koutsonikolas University at Buffalo, SUNY USA
Bhaskar Krishnamachari University of Southern California USA
Sunil Kumar San Diego State University USA
Chin-Feng Lai National Ilan University Taiwan
Jong-Hyouk Lee Sangmyung University Korea
Uichin Lee KAIST Korea
Jong-Seok Lee Yonsei University Korea
Juho Lee Samsung Electronics. Co., Ltd Korea
Lei Lei Beijing Jiaotong University P.R. China
Xianfu Lei Utah State University USA
Ricardo Lent University of Houston USA
Alessandro Leonardi AGT International Germany
Marco Levorato University of California, Irvine USA
Feng Li Indiana University-Purdue University Indianapolis USA
Ming Li Utah State University USA
Wenjia Li New York Institute of Technology USA
Yan Li Beijing Jiaotong University P.R. China
Zhi Li Peking University P.R. China
Husheng Li University of Tennessee USA
Hongkun Li Interdigital USA
Hongwei Li University of Electronic Science and Technology of China P.R. China
Dong Li Institute of Computing Technology, Chinese Academy of Sciences P.R. China
Fan Li Beijing Institute of Technology P.R. China
Lei Li Hefei University of Technology P.R. China
Yun Liao Peking University P.R. China
Phone Lin National Taiwan University Taiwan
Xiaodong Lin University of Ontario Institute of Technology Canada
Po-Ching Lin National Chung Cheng University Taiwan
Kate Ching-Ju Lin Academia Sinica Taiwan
Zhen Ling Southeast University P.R. China
Thomas Little Boston University USA
Benyuan Liu University of Massachusetts Lowell USA
Chi Harold Liu Beijing Institute of Technology P.R. China
Liu Liu University of Electronic Science and Technology of China P.R. China
Anyi Liu Purdue University Fort Wayne USA
Yao Liu University of South Florida USA
Chen Liu UtopiaCompression Corporation USA
Ren Ping Liu CSIRO Australia
Lei Liu University of California, Davis USA
Tsung-Hsien Liu National Chung Cheng University Taiwan
Wei Liu University of Sheffield United Kingdom
Lingjia Liu University of Kansas USA
Errol Lloyd University of Delaware USA
Pascal Lorenz University of Haute Alsace France
Rongxing Lu Nanyang Technological University Singapore
Ning Lu University of Waterloo Canada
Zhuo Lu University of Memphis USA
Kejie Lu University of Puerto Rico at Mayaguez Puerto Rico
Tom H. Luan School of Information Technology Australia
Steven Lumetta University of Illinois at Urbana-Champaign USA
Chung-Horng Lung Carleton University Canada
Hsi-Pin Ma National Tsing Hua University Taiwan
Maode Ma Nanyang Technological University Singapore
Thomas Magedanz TU Berlin / Fraunhofer FOKUS Germany
Veeramani Mahendran University of Oklahoma USA
Mohamed Mahmoud Tennessee Tech University USA
Petri Mähönen RWTH Aachen University Germany
Martin Maier Institut National de la Recherche Scientifique (INRS) Canada
Nagapramod Mandagere IBM Research Center, Almaden USA
Devu Manikantan Shila IIT USA
Marco Maso Mathematical and Algorithmic Sciences Lab Singapore
Michail Matthaiou Queen's University Belfast United Kingdom
Wojciech Mazurczyk Warsaw University of Technology Poland
Muralidhar Medidi Georgia Southern University USA
Darli Mello University of Campinas (UNICAMP) Brazil
Nicolò Michelusi University of Southern California USA
Alexander Min Intel Corporation USA
Satyajayant Misra New Mexico State University USA
Amr Mohamed Qatar University Qatar
Marie-Jose Montpetit MIT Media Laboratory USA
Hassan Moradi Qualcomm Inc. USA
Yang Mu University of Massachusetts Boston USA
Markus Dominik Mueck Intel Mobile Communications Germany
Suresh Muknahallipatna University of Wyoming USA
Brendan Mumey Montana State University USA
Andrea Munari German Aerospace Center (DLR) Germany
Avishek Nag Trinity College Dublin Ireland
Enrico Natalizio Université de Technologie de Compiègne France
Ahasanun Nessa Écoledetechnologiesupérieure Canada
Nam Tran Nguyen Ho Chi Minh City University of Science Vietnam
Wenda Ni Carleton University Canada
Xiaoguang Niu Wuhan University P.R. China
Dusit Niyato Nanyang Technological University Singapore
Jeonghun Noh ASSIA Inc. USA
Bruce Nordman Lawrence Berkeley National Laboratory USA
Tae (Tom) Oh Rochester Institute of Technology USA
Vladimir Oleshchuk University of Agder Norway
Kaoru Ota Muroran Institute of Technology Japan
Yusuf Özçevik Istanbul Technical University Turkey
Sangheon Pack Korea University Korea
Claudio Palazzi University of Padua Italy
Miao Pan Texas Southern University USA
Tian Pan Tsinghua University P.R. China
Wei Pan The Media Lab, Massachusetts Institute of Technology, Cambridge USA
Dimitri Papadimitriou Alcatel-Lucent Bell Belgium
Evangelos Papapetrou University of Ioannina Greece
Kyung-Joon Park DGIST Korea
Al-Sakib Khan Pathan International Islamic University Malaysia (IIUM) Malaysia
Giovanni Pau UPMC - LIP6 USA
Jonathan Petit University of Twente The Netherlands
Massimiliano Pierobon University of Nebraska-Lincoln USA
Robinson Pino ICF International USA
Venkatesha Prasad Delft University of Technology The Netherlands
Roberto Proietti University of California, Davis USA
Ioannis Psaras University College London United Kingdom
Yinan Qi University of Surrey United Kingdom
Giorgio Quer University of California San Diego USA
Jayaparvathy R SSN India
Bharat Rawal Towson University USA
Jian Ren Michigan State University USA
Yi Ren National Chiao Tung University Taiwan
Abdelmounaam Rezgui New Mexico Tech USA
Marco Roccetti University of Bologna Italy
Joel Rodrigues Instituto de Telecomunicações, University of Beira Interior Portugal
Bo Rong Communications Research Center Canada Canada
Dario Rossi Telecom ParisTech France
Hossein Roufarshbaf University of California, Santa Barbara USA
Sarah Ruepp Technical University of Denmark Denmark
Walid Saad Virginia Tech USA
Jose Santa University Centre of Defence at the Spanish Air Force Academy Spain
Nabil Sarhan Wayne State University USA
Panagiotis Sarigiannidis University of Western Macedonia Greece
Ioannis Schizas University of Texas at Arlington USA
Mischa Schmidt NEC Laboratories Europe Germany
Stefano Secci University Pierre et Marie Curie - Paris 6 France
Gökhan Seçinti Istanbul Technical University Turkey
Sahra Sedigh Missouri University of Science and Technology USA
Srini Seetharaman Deutsche Telekom R&D Lab USA
Hangguan Shan Zhejiang University P.R. China
Jun Shao Zhejiang Gongshang University P.R. China
Hamid Sharif University of Nebraska-Lincoln USA
Narasimha Shashidhar Sam Houston State University USA
Xia Shen Peking University P.R. China
Zhijie Shen Hortonworks, Inc. USA
Gangxiang Shen Soochow University P.R. China
Bo Sheng University of Massachusetts Boston USA
Shu Shi Ricoh Innovations Corp. USA
Zhefu Shi University of Missouri - Kansas City USA
Zhiguo Shi Zhejiang University P.R. China
Meral Shirazipour Ericsson USA
Lei Shu Guangdong University of Petrochemical Technology P.R. China
Craig Shue Worcester Polytechnic Institute USA
Pengbo Si Beijing University of Technology P.R. China
Simone Silvestri Missouri University of Science and Technology USA
Harry Skianis University of the Aegean Greece
Dimitrios Skoutas University of the Aegean Greece
Chakchai So-In Khon Kaen University Thailand
JaeSeung Song Sejong University Korea
Min Song The University of Toledo USA
Ronggong Song DRDC-Ottawa Canada
Yi Song Wichita State University USA
Yang Song IBM Research USA
Lingyang Song Peking University P.R. China
Torna Soro University of Massachusetts Boston USA
Salvatore Spadaro Universitat Politecnica de Catalunya (UPC) Spain
Dora Spenza University of Rome "La Sapienza" Italy
Rafal Stankiewicz AGH University of Science and Technology Poland
Julinda Stefa Sapienza University of Rome Italy
Aaron Striegel University of Notre Dame USA
Zhou Su Waseda University Japan
Po-Chyi Su National Central University Taiwan
Guan-Ming Su Dolby Lab USA
Suresh Subramaniam The George Washington University USA
Gita Sukthankar University of Central Florida USA
Radwa Sultan University of Houston USA
Zhi Sun State University of New York at Buffalo USA
Bheemarjuna Reddy Tamma IIT Hyderabad India
Kefeng Tan Qualcomm Atheros USA
Jian Tang Syracuse University USA
Shaojie Tang University of Texas at Dallas USA
Atikan Teber Case Western Reserve University USA
Preetha Thulasiraman Naval Postgraduate School USA
Xiaohua Tian Shanghai Jiao Tong University P.R. China
Yun Tian California State University, Fullerton USA
Ali Tizghadam University of Toronto Canada
Massimo Tornatore Politecnico di Milano Italy
Ramona Trestian Middlesex University United Kingdom
Dirk Trossen InterDigital Europe United Kingdom
Yuh-Ren Tsai National Tsing Hua University Taiwan
Kurt Tutschku Blekinge Institute of Technology Sweden
Anna Tzanakaki University of Bristol United Kingdom
A. Selcuk Uluagac Florida International University USA
Hars Vardhan Samsung Research America USA
Athanasios Vasilakos National Technical University of Athens Greece
Christos Verikoukis Telecommunications Technological Centre of Catalonia Spain
Vasileios Vitsas TEI Thessaloniki Greece
Demosthenes Vouyioukas University of the Aegean Greece
Mehmet Vuran University of Nebraska-Lincoln USA
Cong Wang City University of Hong Kong Hong Kong
Jilong Wang Tsinghua University P.R. China
Li Wang Beijing University of Posts and Telecommunications P.R. China
Licheng Wang Beijing University of Posts and Telecommunications P.R. China
Tao Wang Guangdong University of Technology P.R. China
Xingwei Wang Northeastern University P.R. China
Yu Wang Deakin University Australia
Haining Wang University of Delaware USA
Xiangyang Wang Southeast University P.R. China
Jintao Wang Tshinghua University P.R. China
Yong Wang Xidian University P.R. China
Wenjing Wang Blue Coat Systems Inc. USA
Haohong Wang TCL Research America USA
Mea Wang University of Calgary Canada
Yi Wang Tsinghua University P.R. China
Ping Wang Nanyang Technological University Singapore
Pu Wang Wichita State University USA
Dong Wang University of Notre Dame USA
Ting Wang NEC Laboratories America USA
Yang Wang La Salle University USA
Peng-Hua Wang National Taipei University Taiwan
Zhaohui Wang Michigan Technological University USA
Lei Wang Dalian University of Technology P.R. China
Qiang Wang Lehigh University USA
Ye Wang University of Ontario Institute of Technology Canada
Tianyu Wang Peking University P.R. China
Yu Wang University of North Carolina at Charlotte USA
Yufeng Wang University of South Florida USA
Dawei Wang University of Massachusetts Boston USA
Honggang Wang University of Massachusetts, Dartmouth USA
Tong Wang UMB USA
Wei Wei Xi'an University of Technology P.R. China
Miaowen Wen South China University of Technology P.R. China
Cedric Westphal Huawei Innovation Center USA
Alexander Wijesinha Towson University USA
Youngjoon Won Hanyang University Korea
Shaoen Wu Ball State University USA
Xin-Wen Wu Griffith University Australia
Qiang Wu Juniper Networks USA
Yu Wu Arizona State University USA
Hsiao-Chun Wu Louisiana State University USA
Di Wu Sun Yat-Sen University P.R. China
Fan Wu Shanghai Jiao Tong University P.R. China
Xiaobing Wu Nanjing University P.R. China
Dalei Wu Massachusetts Institute of Technology USA
Minghua Xia Institut National de la Recherche Scientifique (INRS) Canada
Donglin Xia Microsoft USA
Tao Xiang Chongqing University P.R. China
Weidong Xiang University of Michigan, Dearborn USA
Wang Xiaoyi Nokia Solutions and Networks USA
Linda Jiang Xie University of North Carolina at Charlotte USA
Liudong Xing University of Massachusetts Dartmouth USA
Chengwen Xing Beijing Institute of Technology P.R. China
Guobin Xu Towson University USA
Hong Xu City University of Hong Kong Hong Kong
Yuedong Xu Fudan University P.R. China
Weiqiang Xu Zhejiang Sci-Tech University P.R. China
Xiaohua Xu University of Toledo USA
Sugang Xu National Institute of Information and Communications Technology Japan
Kunjie Xu University of Pittsburgh USA
Dan Xu University of California, Davis USA
Guangdong Xu University Technology Sydney Australia
Yibo Xue Tsinghua university P.R. China
Guanhua Yan Los Alamos National Laboratory USA
Qiang Yang Zhejiang University P.R. China
Qing Yang Montana State University USA
Dong Yang Broadcom Corporation USA
Liuqing Yang Colorado State University USA
Jianjun Yang University of North Georgia USA
Chia-Hung Yeh National Sun Yat-Sen University Taiwan
Hen-Geul Yeh California State University, Long Beach USA
Yang Yi University of Kansas USA
Yawei Yin NEC Laboratories America, Inc. USA
Homayoun Yousefi'zadeh University of California, Irvine USA
Meng Yu Virginia Commonwealth University USA
Shui Yu Deakin University Australia
Wei Yu Towson University USA
Shucheng Yu University of Arkansas at Little Rock USA
Shui Yu Deakin University Australia
Bo Yu Colorado State University USA
Cao Yu The University of Massachusetts Lowell USA
Jacky Yu University of Massachusetts Boston USA
Kui Yu Simon Fraser University Canada
Sherali Zeadally University of Kentucky USA
Nan Zhang The George Washington University USA
Chenxi Zhang University of Waterloo Canada
Chenxi Zhang Qualcomm USA
Xiang Zhang University of Electronic Science and Technology of China Canada
Meng Zhang Peking University P.R. China
Rongqing Zhang Colorado State University USA
Haixia Zhang Shandong University P.R. China
Jiucai Zhang University of Nebraska-Lincoln USA
Peng Zhang Xi'an Jiaotong University P.R. China
Tao Zhang New York Institute of Technology USA
Qiong Zhang Fujitsu Laboratories of America USA
Yi Zhang Politecnico di Torino Italy
Jun Zhang University of Denver USA
Zhaoyang Zhang Zhejiang University P.R. China
Jing Zhang Science and Technology on Complex Systems Simulation Laboratory P.R. China
Qian Zhang InterDigital USA
Zaichen Zhang Southeast University P.R. China
Jianzhong Zhang Samsung Telecommunications America USA
Guofeng Zhao ChongQing University of Posts and Telecommunications P.R. China
Weiyi Zhao Staff Software Engineer USA
Yongli Zhao Beijng University of Posts and Telecommunications P.R. China
Yiyang Zhao Tsinghua University P.R. China
Ping Zhou Qualcomm USA
Yadong Zhou Xian Jiaotong University P.R. China
Huan Zhou China Three Gorges University P.R. China
Fen Zhou University of Avignon France
Haibo Zhou Shanghai Jiao Tong University P.R. China
Liang Zhou Nanjing University of Posts and Telecommunications P.R. China
Mingxin Zhou Peking University P.R. China
Haojin Zhu Shanghai Jiao Tong University P.R. China
Hui Zhu Xidian University P.R. China
Liehuang Zhu Beijing Institute of Technology P.R. China
Ye Zhu Cleveland State University USA
Yuming Zhu Texas Instruments Inc. USA
Kun Zhu Nanyang Technological University Singapore
Yi Zhu Hawaii Pacific University USA
Zuqing Zhu University of Science and Technology of China P.R. China
Yanmin Zhu Shanghai Jiao Tong University P.R. China
Ying Zhu Samsung USA
Artur Ziviani LNCC Brazil
Ming Zou Peking University P.R. China
Piotr Zuraniewski University of Amsterdam/TNO The Netherlands
Jason Zurawski Energy Sciences Network USA