Technical Program Committee Members


Ali Abedi University of Maine USA
Koichi Adachi Institute for Infocomm Research (I2R) Singapore
Ferran Adelantado Universitat Oberta de Catalunya Spain
Michael Adeyeye Cape Peninsula University of Technology, Cape Town South Africa
Shakeel Ahmad De Montfort University United Kingdom
Toufik Ahmed University of Bordeaux-1 / CNRS-LaBRI France
Ozgur Akan Koc University Turkey
Kemal Akkaya Southern Illinois University Carbondale USA
Basheer Al-Duwairi Jordan University of Science and Technology Jordan
Slavisa Aleksic Vienna University of Technology Austria
George Amariucai Iowa State University USA
Wei An High Performance Nework Lab, IOA, Chinese Academy of Sciences P.R. China
Bhojan Anand National University of Singapore Singapore
Vishal Anand The College at Brockport, State University of New York USA
Alessandro Andreadis University of Siena Italy
Tricha Anjali Illinois Institute of Technology USA
Rafael Antonello Instituto Federal de Alagoas Brazil
Angelos Antonopoulos Telecommunications Technological Centre of Catalonia (CTTC) Spain
Edward Au Huawei Technologies Canada
Abdelmalik Bachir Imperial College London United Kingdom
Leonardo Badia Università degli Studi di Padova Italy
Mohammad Banat Jordan University of Science and Technology Jordan
Payam Barnaghi University of Surrey United Kingdom
Javier Barria Imperial College London United Kingdom
Mostafa Bassiouni University of Central Florida USA
Norman Beaulieu University of Alberta Canada
Elena Veronica Belmega ENSEA/UCP/CNRS France
Jalel Ben-Othman University of Paris 13 France
Dai Bin Huazhong University of Science and Technology P.R. China
Andrew Blaich Bluebox Security USA
Erik Blasch Air Force Research Lab USA
Alessio Botta University of Napoli Federico II Italy
Dario Bottazzi Marconi Labs Italy
Imed Bouazizi Samsung Standards Research Lab USA
Azzedine Boukerche University of Ottawa Canada
Khaled Boussetta University of Paris 13 France
Christian Callegari University of Pisa Italy
Emilio Calvanese Strinati CEA-LETI France
Prasad Calyam University of Missouri-Columbia USA
Hakki Cankaya Fujitsu Network Communications USA
Xianghui Cao Illinois Institute of Technology USA
Jiannong Cao Hong Kong Polytechnic Univ Hong Kong
Maurizio Casoni University of Modena and Reggio Emilia Italy
Walter Cerroni University of Bologna Italy
Isabella Cerutti Scuola Superiore Sant'Anna Italy
Matteo Cesana Politecnico di Milano Italy
Sammy Chan City University of Hong Kong Hong Kong
Dah-Chung Chang National Central University Taiwan
Ruay-Shiung Chang National Dong Hwa University Taiwan
Yusun Chang Southern Polytechnic State University USA
Mainak Chatterjee University of Central Florida USA
Periklis Chatzimisios Alexander TEI of Thessaloniki Greece
Abdellah Chehri University of Ottawa Canada
Samuel Chen Sun Yat-sen University P.R. China
Hui Chen Virginia State University USA
Yingying Chen Stevens Institute of Technology USA
Lydia Chen IBM Zurich Research Laboratory Switzerland
Yiran Chen University of Pittsburgh USA
Yu Chen Binghamton University USA
Zhenzhong Chen Wuhan University P.R. China
Ling-Jyh Chen Academia Sinica Taiwan
Thomas Chen City University London United Kingdom
Jian Chen Nanjing University of Posts and Telecommunications P.R. China
Jung-Chieh Chen National Kaohsiung Normal University Taiwan
Yung-Fang Chen National Central University Taiwan
Ken Chen Université Paris 13 France
Lei Chen Sam Houston State University USA
Erkang Cheng Temple University USA
Xiang Cheng Peking University P.R. China
Wen-Huang Cheng Academia Sinica Taiwan
Wei Cheng Virginia Commonwealth University USA
Julian Cheng University of British Columbia Canada
Shi Cheng Silicon Image Inc. USA
Feng-Tsun Chien National Chiao Tung University Taiwan
Tai-Lin Chin National Taiwan University of Science and Technology Taiwan
Woong Cho Jungwon University Korea
Young-June Choi Ajou University Korea
Kaushik Chowdhury Northeastern University USA
Hsiao-Chiang Chuang Qualcomm Technologies Inc. USA
Pei-Jung Chung University of Edinburgh United Kingdom
Marcello Cinque University of Naples Italy
Michele Colajanni University of Modena and Reggio Emilia Italy
Garth Crosby Southern Illinois University Carbondale USA
J. Cruz The University of Oklahoma USA
Alberto Dainotti CAIDA, UC San Diego USA
Gerard Damm Alcatel-Lucent USA
Yi Deng Virginia Polytechnic Institute and State University USA
Chris Develder Ghent University - iMinds Belgium
Hao Di University of Electronic Science and Technology of China P.R. China
Marco Di Felice University of Bologna Italy
Marco Di Renzo French National Center for Scientific Research (CNRS) France
Xenofontas Dimitropoulos ETH Zurich Switzerland
Minhua Ding Aalto University Finland
Wei Ding New York Institute of Technology USA
Karim Djouani Tshwane University of Technology South Africa
Octavia Dobre Memorial University of Newfoundland Canada
Liang Du Temple University USA
Lijuan Duan Beijing University of Technology P.R. China
Qiang Duan The Pennsylvania State University USA
Otto Carlos Duarte Universidade Federal do Rio de Janeiro Brazil
Maurizio Dusi NEC Laboratories Europe Germany
George Efthymoglou University of Piraeus Greece
Mohammed El Koutbi University Mohamed V - Souissi Morocco
Abdulmotaleb El Saddik University of Ottawa Canada
Jaafar Elmirghani University of Leeds United Kingdom
Aiman Erbad Qatar University Qatar
Anna Fagertun Technical University of Denmark Denmark
Marwan Fayed University of Stirling United Kingdom
Gianluigi Ferrari University of Parma Italy
Domenico Ficara Cisco Systems Switzerland
Mark Flanagan University College Dublin Ireland
Jeffrey Foerster Intel Corporation USA
Luca Foschini University of Bologna Italy
Hacene Fouchal Université de Reims Champagne-Ardenne France
Xinwen Fu University of Massachusetts Lowell USA
Huirong Fu Oakland University USA
Shengli Fu University of North Texas USA
Andrea Fumagalli UTD USA
Jie Gao Stony Brook University USA
Thierry Gayraud LAAS-CNRS, Université de Toulouse France
Paul Gendron University of Massachusetts Dartmouth USA
Mo Ghorbanzadeh Virginia Tech USA
Shimin Gong Nanyang Technological University Singapore
Dhrubajyoti Goswami Concordia University Canada
Visvasuresh Victor Govindaswamy Concordia University USA
Fabrizio Granelli University of Trento Italy
Zhangyu Guan State University of New York at Buffalo USA
Xue Guangtao Shanghai Jiao Tong University P.R. China
Isabelle Guérin Lassous Université Claude Bernard Lyon 1 - LIP France
Shuo Guo University of Minnesota USA
Bingli Guo Peking University P.R. China
Yassine Hadjadj-Aoul University of Rennes 1 France
Robert Hammell Towson University USA
Youngnam Han KAIST Korea
Israat Tanzeena Haque University of Alberta Canada
Rommie Hardy Army Research Lab USA
Hiroshi Hasegawa Nagoya University Japan
Emad Hassan Menofia University Egypt
Shibo He Arizona State University USA
Liang He Singapore University of Technology and Design Singapore
Jianhua He Aston University United Kingdom
Ting He IBM Research USA
Tamir Hegazy Simon Fraser University Canada
Xiaoyan Hong University of Alabama USA
Zhihong Hong Communications Research Centre Canada
Mohammad Hoque East Tennessee State University USA
Tobias Hoßfeld University of Wuerzburg Germany
Cheng-Hsin Hsu National Tsing Hua University Taiwan
Rose Qingyang Hu Utah State University USA
Kun Hua Lawrence Technological University USA
Yingsong Huang Auburn University USA
Xin Huang Deutsche Telekom R&D Lab USA USA
Yun Huang Carnegie Mellon University USA
  Hui The University of Hong Kong Hong Kong
Bei Hui University of Electronic Science and Techology of China P.R. China
Seung-Hoon Hwang Dongguk University Korea
Muhammad Ilyas National University of Sciences & Technology Pakistan
Raj Jain Washington University in St. Louis USA
Brigitte Jaumard Concordia University Canada
Philip Ji NEC Laboratories America, Inc. USA
Tao Jiang Huazhong University of Science and Technology P.R. China
Wei Jiang MS&T USA
Yuming Jiang Norwegian University of Science and Technology (NTNU) Norway
Tao Jiang University of York United Kingdom
Meilong Jiang InterDigital Communications, LLC USA
Hai Jiang University of Alberta Canada
Wu Jianming Fujitsu R&D Center Canada
Shuyuan Jin CSA P.R. China
Zhigang Jin Tianjin University P.R. China
Hao Jin InterDigital Communications, LLC USA
Changhee Joo UNIST Korea
Josep Miquel Jornet University at Buffalo USA
Jason Jue University of Texas at Dallas USA
Carlos Kamienski Universidade Federal do ABC Brazil
Markus Kampmann Koblenz University of Applied Sciences Germany
Dimitris Kanellopoulos University of Patras Greece
Rajgopal Kannan Louisiana State University USA
George Karagiannidis Aristotle University of Thessaloniki Greece
Georgios Karagiannis University of Twente The Netherlands
Ghassan Karame NEC Laboratories Europe Germany
Helen Karatza Aristotle University of Thessaloniki Greece
Chadi Kari Bridgewater State University USA
Rajkumar Kettimuthu Argonne National Lab USA
Hyun-chul Kim Sangmyung University Korea
Hongseok Kim Sogang University Korea
Tae-Hoon Kim Purdue University Calumet USA
Abdellatif Kobbane ENSIAS, University Mohammed V-Souissi Morocco
Lisimachos Kondi University of Ioannina Greece
Kimon Kontovasilis NCSR Demokritos Greece
Dimitrios Koutsonikolas University at Buffalo, SUNY USA
Adlen Ksentini University of Rennes 1 / IRISA Lab France
Chin-Feng Lai National Ilan University Taiwan
Uichin Lee KAIST Korea
Jong-Seok Lee Yonsei University Korea
Xianfu Lei Utah State University USA
Ricardo Lent Imperial College London United Kingdom
Alessandro Leonardi AGT Group (R&D) GmbH Germany
Ming Li Nanjing University P.R. China
Ming Li Utah State University USA
Qun Li College of William and Mary USA
Wenjia Li Georgia Southern University USA
Husheng Li University of Tennessee USA
Dan Li Tsinghua University P.R. China
Ming Li Deakin University Australia
Qian (Clara) Li Intel Corporation USA
Cheng Li Memorial University of Newfoundland Canada
Ying Li Samsung Telecommunications America USA
Jun Li Communications Research Centre of Canada Canada
Hai Lin Osaka Prefecture University Japan
Po-Ching Lin National Chung Cheng University Taiwan
Kate Ching-Ju Lin Academia Sinica Taiwan
Xiaodong Lin University of Ontario Institute of Technology Canada
Zhen Ling Southeast University P.R. China
Thomas Little Boston University USA
Anyi Liu Purdue University Fort Wayne USA
Yao Liu University of South Florida USA
Duo Liu Chongqing University P.R. China
Jian Liu University of Electronic Science and Technology of China P.R. China
Ren Ping Liu CSIRO Australia
Bo Liu Shanghai Jiao Tong University P.R. China
Yu Liu IBM Canada Canada
Lei Liu University of California, Davis USA
Tsung-Hsien Liu National Chung Cheng University Taiwan
Wei Liu University of Sheffield United Kingdom
Lingjia Liu University of Kansas USA
Jungang Liu University of Ottawa Canada
Chi Harold Liu IBM Research P.R. China
Fangming Liu Huazhong University of Science and Technology P.R. China
Hang Liu The Catholic University of America USA
Liu Liu University of Electronic Science and Technology of China P.R. China
Errol Lloyd University of Delaware USA
Pascal Lorenz University of Haute Alsace France
Chao Lu Towson University USA
Zhuo Lu Intelligent Automation, Inc USA
Kejie Lu University of Puerto Rico at Mayaguez Puerto Rico
Ning Lu University of Waterloo Canada
Rongxing Lu Nanyang Technological University Singapore
Xiao Lu Nanyang Technological University Singapore
Steven Lumetta University of Illinois at Urbana-Champaign USA
Chung-Horng Lung Carleton University Canada
Jian-Zhen Luo Sun Yat-Sen University P.R. China
Hsi-Pin Ma National Tsing Hua University Taiwan
Maode Ma Nanyang Technological University Singapore
Thomas Magedanz TU Berlin / Fraunhofer FOKUS Germany
Martin Maier University of Quebec Canada
Michail Matthaiou Chalmers University of Technology Sweden
Wojciech Mazurczyk Warsaw University of Technology Poland
Muralidhar Medidi Georgia Southern University USA
Marco Mellia Politecnico di Torino Italy
Darli Mello University of Brasilia Brazil
Alexander Min Intel Corporation USA
Satyajayant Misra New Mexico State University USA
Paolo Monti Royal Institute of Technology (KTH) Sweden
Marie-Jose Montpetit MIT Media Laboratory USA
Markus Dominik Mueck Intel Mobile Communications Germany
Peter Mueller IBM Zurich Research Laboratory Switzerland
Brendan Mumey Montana State University USA
Raul Muñoz CTTC Spain
Avishek Nag Trinity College Dublin Ireland
Enrico Natalizio Université de Technologie de Compiègne France
Ahasanun Nessa Écoledetechnologiesupérieure Canada
Nam Tran Nguyen Ho Chi Minh City University of Science Vietnam
Phuc Nguyen Asian Institute of Technology and Management Vietnam
Wenda Ni Carleton University Canada
Angela Nicoara Deutsche Telekom Innovation Laboratories USA USA
Huansheng Ning Beihang University P.R. China
Jeonghun Noh ASSIA Inc. USA
Bruce Nordman Lawrence Berkeley National Laboratory USA
Tae (Tom) Oh Rochester Institute of Technology USA
Eiji Oki The University of Electro-Communications Japan
Vladimir Oleshchuk University of Agder Norway
Sangheon Pack Korea University Korea
Lei Pan Deakin University Australia
Miao Pan Texas Southern University USA
Ai-Chun Pang National Taiwan University Taiwan
Dimitri Papadimitriou Alcatel-Lucent Bell Belgium
Evangelos Papapetrou University of Ioannina Greece
Kyung-Joon Park DGIST Korea
Al-Sakib Khan Pathan International Islamic University Malaysia (IIUM) Malaysia
Tommaso Pecorella Università di Firenze Italy
Sancheng Peng Zhaoqing University P.R. China
Antonio Pescapé University of Napoli Federico II Italy
Jonathan Petit University of Twente The Netherlands
Massimiliano Pierobon University of Nebraska-Lincoln USA
Robinson Pino ICF International USA
Venkatesha Prasad Delft University of Technology The Netherlands
Roberto Proietti University of California, Davis USA
Ioannis Psaras University College London United Kingdom
Qi Qi LSI Corporation USA
Yinan Qi University of Surrey United Kingdom
Daji Qiao Iowa State University USA
Emanuel Radoi University of Brest France
Bharat Rawal Towson University USA
Jian Ren Michigan State University USA
Yi Ren National Chiao Tung University Taiwan
Abdelmounaam Rezgui New Mexico Tech USA
Joel Rodrigues Instituto de Telecomunicações, University of Beira Interior Portugal
Bo Rong Communications Research Center Canada Canada
Dario Rossi Telecom ParisTech France
Hossein Roufarshbaf University of California, Santa Barbara USA
Bimal Roy Indian Statistical Institute India
Sarah Ruepp Technical University of Denmark Denmark
Walid Saad University of Miami USA
Anirudha Sahoo NIST USA
Jose Santa University of Murcia Spain
Nabil Sarhan Wayne State University USA
Panagiotis Sarigiannidis University of Western Macedonia Greece
Mischa Schmidt NEC Laboratories Europe Germany
Stefano Secci University Pierre et Marie Curie - Paris 6 France
Sahra Sedigh Missouri University of Science and Technology USA
Srini Seetharaman Deutsche Telekom R&D Lab USA
Amir Sepasi Zahmati Ryerson University Canada
Hangguan Shan Zhejiang University P.R. China
Yin Shao Volpe and Koenig, P. C. USA
Hamid Sharif University of Nebraska-Lincoln USA
Narasimha Shashidhar Sam Houston State University USA
Zhijie Shen Hortonworks, Inc. USA
Gangxiang Shen Soochow University P.R. China
Bo Sheng University of Massachusetts Boston USA
Tsang-Ling Sheu National Sun Yat-Sen University, Kaohsiung Taiwan
Jinglin Shi Institute of Computing Technology, Chinese Academy of Sciences P.R. China
Zhefu Shi University of Missouri - Kansas City USA
Shu Shi Ricoh Innovations Corp. USA
Zhiguo Shi Zhejiang University P.R. China
Meral Shirazipour Ericsson USA
Lei Shu Guangdong University of Petrochemical Technology P.R. China
Zhihui Shu University of Nebraska-Lincoln USA
Pengbo Si Beijing University of Technology P.R. China
Harry Skianis University of the Aegean Greece
Dimitrios Skoutas University of the Aegean Greece
Ronggong Song DRDC-Ottawa Canada
Wei Song University of New Brunswick Canada
JaeSeung Song Sejong University Korea
Salvatore Spadaro Universitat Politecnica de Catalunya (UPC) Spain
Rafal Stankiewicz AGH University of Science and Technology Poland
Vladimir Stankovic University of Strathclyde United Kingdom
Aaron Striegel University of Notre Dame USA
Guan-Ming Su Dolby Lab USA
Po-Chyi Su National Central University Taiwan
Hsuan-Jung Su National Taiwan University Taiwan
Suresh Subramaniam The George Washington University USA
Shinya Sugiura Tokyo University of Agriculture and Technology Japan
Zhi Sun State University of New York at Buffalo USA
Gang Sun University of Electronic Science and Technology of China P.R. China
Ali Tajer Wayne State University USA
Shilpa Talwar Intel USA
Chenghua Tang Sun Yat-Sen University P.R. China
Shensheng Tang Missouri Western State University USA
Xuan Tang Tsinghua University P.R. China
Jian Tang Syracuse University USA
Atikan Teber Case Western Reserve University USA
Xiaohua Tian Shanghai Jiaotong University P.R. China
David Tipper University of Pittsburgh USA
Ali Tizghadam University of Toronto Canada
Massimo Tornatore Politecnico di Milano Italy
Dirk Trossen University of Cambridge United Kingdom
Yuh-Ren Tsai National Tsing Hua University Taiwan
Damla Turgut University of Central Florida USA
Kurt Tutschku Blekinge Institute of Technology Sweden
Anna Tzanakaki AIT Greece
Selcuk Uluagac Georgia Institute of Technology USA
Hans van den Berg University of Twente The Netherlands
Rath Vannithamby Intel USA
Athanasios Vasilakos National Technical University of Athens Greece
Vladan Velisavljević University of Bedfordshire United Kingdom
Christos Verikoukis Telecommunications Technological Centre of Catalonia Spain
Vasileios Vitsas TEI Thessaloniki Greece
Demosthenes Vouyioukas University of the Aegean Greece
Akkari Wafa National School of Computer Sciences, ENSI University of Manouba Tunisia
Haohong Wang TCL Research America USA
Jilong Wang Tsinghua University P.R. China
Tao Wang Guangdong University of Technology P.R. China
Xingwei Wang Northeastern University P.R. China
Yu Wang Deakin University Australia
Zhi Wang NanKai University P.R. China
Fei Wang IBM Almaden Research Center USA
Honggang Wang University of Massachusetts, Dartmouth USA
Xiangyang Wang Southeast University P.R. China
Danghui Wang Northwestern Polytechnical University P.R. China
Yi Wang The Hong Kong Polytechnic University Hong Kong
Mea Wang University of Calgary Canada
Dan Wang The Hong Kong Polytechnic University Hong Kong
Xiaofeng Wang National University of Defense Technology P.R. China
Dong Wang University of Illnois at Urbana Champaign USA
Yang Wang La Salle University USA
Peng-Hua Wang National Taipei University Taiwan
Tong Wang RWTH Aachen University Germany
Wei Wang South Dakota State University USA
Qiang Wang Lehigh University USA
Ye Wang University of Ontario Institute of Technology Canada
Shaowei Wang Nanjing University P.R. China
Xudong Wang University of Michigan-Shanghai Jiao Tong University Joint Institute P.R. China
Yufeng Wang University of South Florida USA
Chonggang Wang InterDigital Communications USA
Haining Wang College of William and Mary USA
Wei Wei Xi'an University of Technology P.R. China
Alexander Wijesinha Towson University USA
Richard Wolff Montana State University USA
Youngjoon Won Hanyang University Korea
Shaoen Wu Ball State University USA
Xin-Wen Wu Griffith University Australia
Shan-Hung Wu National Tsing Hua University Taiwan
Yanyan Wu Xi'an Jiaotong-Liverpool University P.R. China
Dalei Wu Massachusetts Institute of Technology USA
Fan Wu Shanghai Jiao Tong University P.R. China
Xiaobing Wu Nanjing University P.R. China
Hongyi Wu University of Louisiana at Lafayette USA
Haitao Xia LSI USA
Ming Xia Ericsson Research US USA
Minghua Xia Institut National de la Recherche Scientifique (INRS) Canada
Donglin Xia Microsoft USA
Weidong Xiang University of Michigan, Dearborn USA
Yi Xie Sun Yat-Sen University P.R. China
Yan Xin Samsung Research America- Dallas USA
Liudong Xing University of Massachusetts Dartmouth USA
Bo Xing Yahoo USA
Guobin Xu Towson University USA
Sugang Xu National Institute of Information and Communications Technology Japan
Kunjie Xu University of Pittsburgh USA
Dan Xu University of California, Davis USA
Ke Xu Tsinghua University P.R. China
Yibo Xue Tsinghua university P.R. China
Xiaoping Xue Tongji University P.R. China
Wei Yan Peking University P.R. China
Guanhua Yan Los Alamos National Laboratory USA
Qiang Yang Zhejiang University P.R. China
Dong Yang Broadcom Corporation USA
Ming Yang Southern Polytechnic State University USA
Chia-Hung Yeh National Sun Yat-Sen University Taiwan
Hen-Geul Yeh California State University, Long Beach USA
Yang Yi University of Missouri - Kansas City USA
Yawei Yin University of California, Davis USA
Homayoun Yousefi'zadeh University of California, Irvine USA
Shui Yu Deakin University Australia
F. Richard Yu Carleton University Canada
Shucheng Yu University of Arkansas at Little Rock USA
Wei Yu Towson University USA
Meng Yu Virginia Commonwealth University USA
Hongfang Yu University of Electronic Science and Technology of China P.R. China
Sherali Zeadally University of Kentucky USA
Tong Zhang Rensselaer Polytechnic Institute USA
Haixia Zhang Shandong University P.R. China
Jiucai Zhang University of Nebraska-Lincoln USA
Baoxian Zhang University of the Chinese Academy of Sciences P.R. China
Yanping Zhang Gonzaga University USA
Qiong Zhang Fujitsu Laboratories of America USA
Yi Zhang Politecnico di Torino Italy
Jing Zhang Science and Technology on Complex Systems Simulation Laboratory P.R. China
Qian Zhang InterDigital USA
Guofeng Zhao ChongQing University of Posts and Telecommunications P.R. China
Yongli Zhao Beijng University of Posts and Telecommunications P.R. China
Kai Zheng IBM China Research Lab P.R. China
Jiazhen Zhou University of Wisconsin - Whitewater USA
Yifeng Zhou Communications Research Centre Canada
Haibo Zhou Shanghai Jiao Tong University P.R. China
Liang Zhou Nanjing University of Posts and Telecommunications P.R. China
Liehuang Zhu Beijing Institute of Technology P.R. China
Ting Zhu State University of New York at Binghamton USA
Yuming Zhu Texas Instruments USA
Yi Zhu Hawaii Pacific University USA
Zuqing Zhu University of Science and Technology of China P.R. China
Xu Zhu University of Liverpool United Kingdom
Artur Ziviani LNCC Brazil
Shihong Zou Beijing University of Posts&Telecommunication P.R. China
Piotr Zuraniewski University of Amsterdam/TNO The Netherlands
Jason Zurawski Energy Sciences Network USA